Thermistance is the first Indian start-up completely devoted to develop advanced passive cooling technologies and its commercialization. Our world class team is continuously working to develop innovative micro and miniature cooling devices. We are also developing our research and development centre in Pune.
Heat Pipes have been subjected to a variety of adaptation, revamping, and reconstruction. One such adaptation is a Vapor Chamber. Vapor chambers are a type of thin, planar Heat Pipes, also known as heat spreaders, spreading heat in two dimensions. Changing the layout of a few elements has led to a divergent collection of properties, specific to Vapour Chambers. The capability to accept a higher heat flux and dissipate heat from small heat sources are some of the unique properties of the Vapor Chamber.
In simple terms, a Vapour Chamber is a planar heat pipe, with the heat sink at its base. Many components of the Heat Pipe in a different configuration make up the Vapour Chamber.
1. Hollow cylinder: A hermetically sealed hollow cylinder gives the Vapor Chamber a sleek design. Usually, it is made of copper plates.
2. Internal support: The hollow chamber is fitted with many pillars of copper. When pressure is applied to this vacuum-sealed chamber, these posts provide mechanical support and prevent the chamber from collapsing on itself.
3. Evaporator: The part of the Vapor Chamber that comes in contact with the small-sized heat source is the evaporator.
4. Wick: The wick lines the inner side of the entire vapor chamber. The porous material in this case functions as a closed-loop capillary recirculation system. Meshes and powders are used for this purpose.
5. Working fluid: : A coolant is used for the evaporation and condensation and the resulting heat transfer.
1. Convection: The heat transfer is mainly by the bulk movements of gaseous molecules, creating a lesser density area. They move to reach the cooler areas of the chamber by convection.
2. Heat transformer: When there is a high heat flux from the source, these chambers transform them to lower heat fluxes by their virtue of heat dissipation in two dimensions.
3. Capillary pressure: The condensate is brought back to the evaporator by the capillary pressure exerted by the fluid on the wick structure.
The heat source delivers heat input to the evaporator zone. The wick containing the working fluid, in contact with the evaporator zone, vaporizes. This causes the looser arrangement of molecules, thus transporting the lesser dense vapor away from the evaporator, by the process of convection. This property of the molecules to organize themselves in the vapor chamber proves advantageous for its thermal properties. Thus, the vapor chamber acts as an isothermal heat spreader.
These vapors, when they hit the cooler areas of the chamber, condense. Heat removal occurs by forced convection, natural convection, or liquid cooling. The condensate reaches the evaporator zone by the force of capillary pressure through the pores of the wick.
1. High power density: In the case of smaller heat sources, where heat generation is large, using Heat Pipes proves to be a limitation as multiple Heat Pipes need to be arranged over the heat source. Using Vapor Chambers eliminates this need by efficiently handling high power densities over a small heat source.
2. Lightweight:Vapour Chamber has simplicity in its construction, which makes it very compact and lightweight.
3. Height sensitive: In the case of sleek designs of computers like notebooks and surface mount circuit boards, where the arrangement of an array of heat pipes can compromise on the design, thinner vapor chambers can be used.
4. Antigravity operation: Vapor chambers can work even when they are inverted, thus proving to be advantageous in various orientations and space.
1. CPU coolers: CPUs have high TDP and high heat flux. Vapor Chambers prove to be a great cooling method for such devices.
2. Gaming laptops and notebook computers: Vapor chambers can cool these electronic devices without compromising on their trim design.
In simple terms, a Vapour Chamber is a planar heat pipe, with the heat sink at its base. Many components of the Heat Pipe in a different configuration make up the Vapour Chamber.
1. Hollow cylinder: A hermetically sealed hollow cylinder gives the Vapor Chamber a sleek design. Usually, it is made of copper plates.
2. Internal support: The hollow chamber is fitted with many pillars of copper. When pressure is applied to this vacuum-sealed chamber, these posts provide mechanical support and prevent the chamber from collapsing on itself.
3. Evaporator: The part of the Vapor Chamber that comes in contact with the small-sized heat source is the evaporator.
4. Wick: The wick lines the inner side of the entire vapor chamber. The porous material in this case functions as a closed-loop capillary recirculation system. Meshes and powders are used for this purpose.
5. Working fluid: : A coolant is used for the evaporation and condensation and the resulting heat transfer.
1. Convection: The heat transfer is mainly by the bulk movements of gaseous molecules, creating a lesser density area. They move to reach the cooler areas of the chamber by convection.
2. Heat transformer: When there is a high heat flux from the source, these chambers transform them to lower heat fluxes by their virtue of heat dissipation in two dimensions.
3. Capillary pressure: The condensate is brought back to the evaporator by the capillary pressure exerted by the fluid on the wick structure.
The heat source delivers heat input to the evaporator zone. The wick containing the working fluid, in contact with the evaporator zone, vaporizes. This causes the looser arrangement of molecules, thus transporting the lesser dense vapor away from the evaporator, by the process of convection. This property of the molecules to organize themselves in the vapor chamber proves advantageous for its thermal properties. Thus, the vapor chamber acts as an isothermal heat spreader.
These vapors, when they hit the cooler areas of the chamber, condense. Heat removal occurs by forced convection, natural convection, or liquid cooling. The condensate reaches the evaporator zone by the force of capillary pressure through the pores of the wick.
1. High power density: In the case of smaller heat sources, where heat generation is large, using Heat Pipes proves to be a limitation as multiple Heat Pipes need to be arranged over the heat source. Using Vapor Chambers eliminates this need by efficiently handling high power densities over a small heat source.
2. Lightweight:Vapour Chamber has simplicity in its construction, which makes it very compact and lightweight.
3. Height sensitive: In the case of sleek designs of computers like notebooks and surface mount circuit boards, where the arrangement of an array of heat pipes can compromise on the design, thinner vapor chambers can be used.
4. Antigravity operation: Vapor chambers can work even when they are inverted, thus proving to be advantageous in various orientations and space.
1. CPU coolers: CPUs have high TDP and high heat flux. Vapor Chambers prove to be a great cooling method for such devices.
2. Gaming laptops and notebook computers: Vapor chambers can cool these electronic devices without compromising on their trim design.
